Bonchip Electronics
 
Shiga
Katin  (0)

HMG.1B.305.CLNP Ƙayyadaddun Fasaha

CONN PNL MNT RCPT 5SKT STR PCB

Siffar Samfur Siffata darajar
Category Hada, Interconnects / Hudun Kula
Manufacturer LEMO
Factory Lead Time 3 Weeks
Voltage - Rated -
Shell Size, MIL -
Shell Material, Finish Brass, Chrome Plated
Packaging Bulk
Operating Temperature -20°C ~ 100°C
Mounting Type Panel Mount, Flange; Through Hole
Features Shielded
Current Rating 9A
Contact Finish Gold
Siffar Samfur Siffata darajar
Part Status Active
RoHS Status ROHS3 Compliant
Pbfree Code yes
Termination Solder
Shell Size - Insert 305
Series 1B
Orientation G
Number of Positions 5
Ingress Protection IP68 - Dust Tight, Waterproof
Fastening Type Push-Pull, Detent Lock
Contact Finish Thickness 59µin (1.50µm)
Connector Type Receptacle, Female Sockets
View Similar

HMG.1B.305.CLNP Takardu

Zazzage takaddun bayanai da takaddun masana'anta don HMG.1B.305.CLNP

Sauran sun hada da   "HMG.1"   sassa

Abubuwan da ke biyowa sun haɗa da  'HMG.1' 

Sashe # Mai ƙira Kashi samuwa
HMG.1B.303.CLLP LEMO Hudun Kula 2565
HMG.1B.305.CLLP LEMO Hudun Kula 2674
HMG.1B.305.CLWP LEMO Hudun Kula 2796
HMG.1B.307.CLLP LEMO Hudun Kula 2735
HMG.1B.308.CLLP LEMO Hudun Kula 2681
HMG.1B.310.CLLP LEMO Hudun Kula 2532
HMG.1B.310.CLNP LEMO Hudun Kula 2757
HMG.1B.314.CLNP LEMO Hudun Kula 0
HMG.1B.316.CLNP LEMO Hudun Kula 2626
HMG.1K.306.YLNP LEMO Hudun Kula 2708

Abokan ciniki kuma sun duba

Matsalar Biyan Kuɗi

Ana iya zaɓar hanyar biyan kuɗi daga hanyoyi huɗu da aka nuna a ƙasa: TT a gaba (canja wurin banki), Western Union, Katin Kiredit, PayPal.

Kyakkyawan Sabis

Dandali na Ƙwararru
Faɗin samfura iri-iri
Daban-daban hanyoyin biyan kuɗi
Abun asali kawai
Bayarwa cikin cikakken sauri
Kwanaki 365 ingancin tabbacin

Matsala gama gari

Idan kuna da wasu tambayoyi, zaku iya tuntuɓar mu cikin sauri ta hanyoyi masu zuwa:

Tel : 86-755-86374759

Imel : [email protected]

Adireshi : D1 6th floor,Lehui Center,Jihua Road 489 Longgang District, Shenzhen-518129, China

Jagoran Siyayya

Jirgin ruwa Lokacin bayarwa Za a shirya fakitin don isarwa a cikin kwanaki 1-2 daga ranar da duk abubuwan suka isa shagon mu. Za'a iya fitar da kayan cikin hannun jari a cikin sa'o'i 24. Lokacin isarwa ya dogara da Hanyar jigilar kaya da wuraren isarwa.
Yawan jigilar kaya Adadin jigilar kayayyaki ya dogara ne akan girman, nauyi, maƙasudin fakitin. Bonchip yana ba da zaɓuɓɓukan jigilar kaya ta hanyar manyan dillalai DHL, FedEx da UPS. Muna kuma bayar da sabis na asusun jigilar kaya ga abokan cinikin da ke son a yi musu lissafin kai tsaye don jigilar kaya.
Hanyoyin jigilar kaya
Bibiyan jigilar kaya Da zarar an isar da kayan aikin, za a sanar da lambar bin diddigin ta imel nan da nan. Hakanan ana iya samun lambar bin diddigin a cikin tarihin tsari.
Yana dawowa Yana dawowa Dole ne a yi duk dawo da shi a cikin kwanaki 60 na ranar daftari kuma a kasance tare da ainihin lambar daftari, takardar shaidar katin garanti, hoton sassa da taƙaitaccen bayani ko rahoton gwaji na dalilin dawowar. Ba za a karɓi dawowa ba bayan kwanaki 60. Dole ne kayan da aka dawo dasu su kasance cikin marufi na asali kuma cikin yanayin sake siyarwa. Ba za a karɓi sassan da aka dawo saboda kuskuren abokin ciniki a lokacin ƙima ko siyarwa ba. Da fatan za a tuntuɓi sabis na abokin ciniki don izinin dawowa kafin jigilar kaya.
Yin oda Yadda ake Sayi Umurnin kan layi da na layi suna samuwa duka.
Idan kuna da wata matsala ta aiki, da fatan za a ji daɗin tuntuɓar sabis ɗin abokin ciniki.
Biya TT a gaba (canja wurin banki), Western Union, Katin Kiredit, PayPal. Abokin ciniki yana da alhakin kuɗin jigilar kaya, cajin banki, ayyuka da haraji.
HMG.1B.305.CLNP masana'antun iri: LEMO, Bonchip hannun jari, HMG.1B.305.CLNP farashin tunani. HMG.1B.305.CLNP sigogi, HMG.1B.305.CLNP Datasheet PDF da fil zazzage bayanin zane. Kuna iya amfani da HMG.1B.305.CLNP Masu haɗawa masu toshewa, DSP Kwanan wata PDF, nemo HMG.1B.305.CLNP zanen fil da zane-zane da kuma tsarin amfani da aiki, HMG.1B.305.CLNP koyawa na lantarki.Zaka iya saukewa daga Bonchip.
0